Product ID Document Name Status ANSI DoD
IPC-4202
Flexible Base Dielectrics for Use in Flexible Printed Wiring Not yet published, will supersede
IPC-FC-231C
IPC-4203
Adhesive Coated Dielectric Films for Use as Cover Sheets IPC-FC-232C
Not yet published Supersedes
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Not yet published, will supersede
IPC-FC-241C
IPC-4411
Specification and Characterization Methods for Nonwoven Para-
Aramid Reinforcement
Orig. 4/99
IPC-4412
Specification for Finished Fabric Woven form "E" Glass for
Printed Boards
Not yet published, will supersede
IPC-EG-140A
IPC-4552
Electroless Nickel/Immersion Gold (ENIG) Plating for Electronic
Interconnections
Not yet published
IPC-4562
Metal Foil for Printed Wiring Applications Supersedes IPC-MF-150G
Orig. 5/00
IPC-4563 Resin-Coated Metal Foil for Printed Boards Not yet published, will supersede
IPC-CF-148A
IPC-4902
Specification for Materials for Embedded Passive Devices for
Printed Boards
Not yet published
IPC-TC-500
Through-hole standard
IPC-TC-550
IPC-6011
Generic Performance Specification for Printed Boards Orig. 7/96
IPC-6012
Qualification and Performance Specification for Rigid Printed
Boards
Amend. 1
7/00
Rev. A 10/99
Orig. 7/96
IPC-6013
Qualification and Performance Specification for Flexible Printed
Boards
Supersedes IPC-RF-245 and IPC-FC-
250
Amend. 1 04/00
Orig. 11/98
IPC-6015
Qualification and Performance Specification for Organic Multichip
Module (MCM-L) Mounting and Interconnecting Structures
Orig. 2/98
IPC-6016
Qualification and Performance Specification for High Density
Interconnect (HDI) Layers or Boards
Orig. 05/99
IPC-6018
Microwave End Product Board Inspection and Test Orig. 1/98
IPC/JPCA-6202
Performance Guide Manual for Single- and Double-Sided Flexible
Printed Wiring Boards
Orig. 2/99
PAS-62084 Implementation of Flip Chip and Chip Scale Technology
PAS-62119 Generic Requirements for Implementation of Product
Manufacturing Description Data & TRFR methodology
PAS-62123 Performance Guide Manual for Single & Double Sided flexible pwb
IPC/JPCA-6801 Terms & Definitions, Test Methods, and Design Examples for
Build-Up/High Density Interconnection
Orig. 1/00
IPC-7070 Series
General Requirements for Component Mounting Not yet published
IPC-7071
General Requirements for Component Mounting Not yet published
IPC-7072
Sectional Requirements for Through-Hole Component Mounting Not yet published
IPC-7073
Sectional Requirements for Standard Surface Mount Technology
Component Mounting
Not yet published
IPC-7074
Sectional Requirements for Fine Pitch and High Pin Count
Component Mounting
Not yet published
IPC-7075
Sectional Requirements for High Pin Count Area Array Component
Mounting
Not yet published
IPC-7076
Sectional Requirements for Chip Scale and Chip Size Component
Mounting
Not yet published
IPC-7077
Sectional Requirements for Wire Bonding Bare Chip Component
Mounting
Not yet published
IPC-7078
Sectional Requirements for Flip Chip Component Mounting (Direct
Chip Attach)
Not yet published
IPC-7095
Design and Assembly Process Implementation for BGAs Orig. 8/00
IPC-7525
Guidelines for Stencil Design Orig. 5/00
(301 Seiten)
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