Product ID Document Name Status ANSI DoD
IPC-PD-335
Electronic Packaging Handbook Orig. 12/89
IPC-NC-349
Computer Numerical Control Formatting for Drillers and Routers Orig. 8/85
IPC-D-350
Printed Board Description in Digital Form; Technical Content
Identical to IEC-61182-1 (PAS)
Rev. D 7/92
Rev. C 10/85
Rev. B 8/77
Rev. A 2/75
Orig. 8/72
IPC-D-351
Printed Board Drawings in Digital Form Orig. 8/85
IPC-D-352
Electronic Design Data Description for Printed Boards in Digital
Form
Orig. 8/85
IPC-D-354
Library Format Description for Printed Boards in Digital Form Orig. 2/87
IPC-D-355
Printed Board Assembly Description in Digital Form Orig. 1/95
IPC-D-356
Bare Board Electrical Test Information in Digital Form Rev. A 1/98
Orig. 3/92
IPC-AM-361
Specification for Rigid Substrates for Additive Process Printed
Boards
Superseded by IPC-4101
Orig. 1/82
IPC-MB-380
Guidelines for Molded Interconnection Devices Orig. 10/90
IPC-D-390
Automated Design Guidelines Rev. A 2/88
Orig. 7/74
IPC-C-406
Design and Application Guidelines for Surface Mount Connectors Orig. 1/90
IPC-CI-408
Design and Application Guidelines for the Use of Solderless
Surface Mount Connectors
Orig. 1/94
IPC-BP-421
General Specification for Rigid Printed Board Backplanes with
Press Fit Contacts
Obsolete without replacement
Reaffirmed 4/90
Orig. 10/80
IPC-D-422
Design Guide for Press Fit Rigid Printed Board Backplanes Orig. 9/82
IPC-DW-424
General Specification for Encapsulated Discrete Wire
Interconnection Boards
Orig. 1/95
IPC-DW-425
Design and End Product Requirements for Discrete Wiring Boards Rev. A 5/90
Orig. 9/82
IPC-DW-426
Specifications for Assembly of Discrete Wiring Orig. 12/87
IPC-TR-460
Trouble-Shooting Checklist for Wave Soldering Printed Wiring
Boards
Rev. A 2/84
Orig. 1973
IPC-TR-461
Solderability Evaluation of Thick and Thin Fused Coatings Orig. 3/79
IPC-TR-462
Solderability Evaluation of Printed Boards with Protective Coatings
Over Long Term Storage
Orig. 10/87
IPC-TR-464
Accelerated Aging for Solderability Evaluations Rev. A 12/87
Orig. Pub.4/84
IPC-TR-465-1
Round Robin Test on Steam Ager Temperature Control Stability Orig. 1993
IPC-TR-465-2
The Effect of Steam Aging Time and Temperature on Solderability
Test Results
Orig. 1993
IPC-TR-465-3
Evaluation of Steam Aging on Alternative Finishes, Phase IIA Orig. 7/96
IPC-TR-466
Wetting Balance Standard Weight Comparison Test Orig. 4/95
IPC-TR-467
Supporting Data and Numerical Examples for ANSI/J-STD-001
Appendix D
Orig. 10/96
IPC-TR-468
Factors Affecting Insulation Resistance Performance of Printed
Boards
Orig. 3/79
IPC-TR-470
Thermal Characteristics of Multilayer Interconnection Boards Orig. 1/74
IPC-TR-474
An Overview of Discrete Wiring Techniques Obsolete without replacement
Reprint 1984
Orig. 3/79
IPC-TR-476
How to Avoid Metallic Growth Problems on Electronic Hardware
Rev. A Electrochemical Migration Electrically Induced Failures In
Printed Assembles
Rev. A 6/84 (new title)
Orig. 9/77
IPC-TR-480
Results of Multilayer Test Program Round Robin IV Phase I Obsolete without replacement
Orig. 9/75
IPC-TR-481
Results of Multilayer Test Program Round Robin V Orig. 4/81
IPC-TR-482
New Developments in Thin Copper Foils Orig. 7/93
(301 Seiten)
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