Product ID Document Name Status ANSI DoD
IPC-TR-483
Dimensional Stability Testing of Thin Laminates - Report on Phase
I International Round Robin Test Program
Rev. A 3/91
Addendums 10/87
Orig. 4/84
IPC-TR-484
Results of IPC Cooper Foil Ductility Round Robin Study Orig. 4/86
IPC-TR-485
Results of Cooper Foil Rupture Strength Test Round Robin Study Orig. 3/85
IPC-TR-486
Report on Round Robin Study to Correlate Interconnect Stress Test
(IST) with Thermal Stress/Microsectioning Evaluations for
Detecting the Presence of Inner-layer Separations
Orig. 07/01
IPC-TR-549
Measles in Printed Wiring Boards Orig. 11/73
IPC-TR-551
Quality Assessment of Printed Boards Used for Mounting and
Interconnecting Electronic Components
Orig. 7/93
IPC-DR-570
General Specification for 1/8 Inch Diameter Shank Carbide Drills
for Printed Boards
Rev. A 4/84
Orig. 1/79
IPC-DR-572
Drilling Guidelines for Printed Boards Orig. 4/88
IPC-TR-576
Additive Process Evaluation Obsolete without replacement
Orig. 9/77
IPC-TR-578
Leading Edge Manufacturing Technology Report - Resulting of a
Round Robin Study on Minimum Conductor Width and Plated-
Through Holes in Rigid, Bare Copper, Double-Sided Printed
Wiring Boards
Orig. 9/84
IPC-TR-579
Round Robin Reliability Evaluation of Small Diameter Plated
Through Holes in Printed Wiring Boards
Orig. 9/88
IPC-TR-580
Cleaning and Cleanliness Test Program Phase 1 Test Results Orig. 10/89
IPC-TR-581
IPC Phase 3 Controlled Atmosphere Soldering Study Orig. 8/94
IPC-TR-582
IPC Phase 3 No-Clean Flux Study Orig. 11/94
IPC-A-600
Acceptability of Printed Boards Rev. F 11/99
Rev. E 8/95
Rev. D '89
Rev. C '78
Rev. B '74
Rev. A '70
Orig. '64
IPC-SS-605
Printed Board Quality Evaluation Slide Set Obsolete without replacement
IPC-QE-605
Printed Board Quality Evaluation Handbook Rev. A 2/99
IPC-A-610
Acceptability of Electronic Assemblies Rev. C 1/00
Rev. B 12/94
Rev. A 3/90
Orig. 8/83
IPC-QE-615
Assembly Quality Evaluation Handbook Orig. 3/93
IPC/WHMA-A-
620
Acceptability of Electronic Wire Harnesses and Cables Not yet published
IPC-AI-640
User's Guidelines for Automated Inspection of Unpopulated Thick
Film Hybrid Substrates
Obsolete without replacement
Orig. 1/87
IPC-AI-641
User's Guidelines for Automated Solder Joint Inspection Obsolete without replacement
Orig. 1/87
IPC-AI-642
User's Guidelines for Automated Inspection of Artwork, Interlayers,
and Unpopulated PWB's
Obsolete without replacement
Orig. 10/88
IPC-OI-645
Standard for Visual Optical Inspection Aids Orig. 10/93
IPC-TM-650
Test Methods Manual Updated per test method
IPC-ET-652
Guidelines and Requirements for Electrical Testing of Unpopulated
Printed Boards
Orig. 10/90 Superseded by IPC-9252
IPC-QL-653
Qualification of Facilities that Inspect/Test Printed Boards,
Components, and Material
Rev. A 11/97
Orig. 8/88
IPC-MI-660
Incoming Inspection of Raw Materials Manual Orig. 2/84
IPC-R-700
Suggested Guidelines for Modification, Rework and Repair of
Printed Boards and Assemblies
Superseded by IPC-7711 and 7721
C 1/88
B 9/77
A 12/71
Orig. 9/67
IPC-TA-720
Technology Assessment Handbook on Laminates
(301 Seiten)
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