Product ID Document Name Status ANSI DoD
IPC-DRM-40
Through-Hole Solder Joint Evaluation Desk Reference Manual Rev. D 7/00
Rev. C 9/99
Rev. B 1/99
Rev. A 8/97
Orig. 5/97
IPC-T-50
Terms and Definitions Interconnecting and Packaging Electronic
Circuits
Rev. F 6/96
Rev. E 7/92
Rev. D 11/88
Rev. C 3/85
Rev. B 6/80
Rev. A 8/76
Orig. 8/75
IPC-DRM-53
Introduction to Electronics Assembly Orig. 6/00
IPC-SC-60
Post Solder Solvent Cleaning Handbook Rev. A 8/99
Orig. 4/87
IPC-SA-61
Post-Solder Semi-Aqueous Cleaning Handbook Orig. 7/95
IPC-AC-62
Post Solder Aqueous Cleaning Handbook Rev. A 1/96
Orig. 12/86
IPC-CH-65
Guidelines for Cleaning of Printed Boards and Assemblies Rev. A 9/99
Orig. 12/90
IPC-CS-70
Guidelines for Chemical Handling Safety in Printed Board
Manufacturing
Orig. 8/88 Obsolete without
replacement
IPC-CM-78
Guidelines for Surface Mounting and Interconnecting Chip Carriers Superseded by IPC-SM-780
Rev. C - 3/88
Orig. 11/83
IPC-MP-83
IPC Policy on Metrication Orig. 8/85 Obsolete without
replacement
IPC-PC-90
General Requirements for Implementation of Statistical Process
Control
Superseded by IPC-9191
Orig. 10/90
IPC-QS-95
General Requirements for Implementation of ISO 9000 Quality
Systems
Obsolete without replacement
Orig. 4/93
IPC-L-108
Specification for Thin Metal Clad Base Materials for Multilayer
Printed Boards
Rev. B 6/90 Superseded by IPC-4101
Rev. A 10/80
Orig. 3/76
IPC-L-109
Specification for Resin Impregnated Fabric (Pregreg) for Multilayer
Printed Boards
Superseded by IPC-4101
Rev. B 7/92
Rev. A 10/80
Orig. 3/76
IPC-L-110
Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed
Circuit Boards
Rev. A Superseded by IPC-L-109 and
IPC-4101
IPC-CC-110
Guidelines for Selecting Core Constructions for Multilayer Printed
Wiring Board Applications
Superseded by IPC-4121
Rev. A 12/97
Orig. 1/94
IPC-L-112
Specification for Composite Metal Clad Base materials for Printed
Boards
Superseded by IPC-4101
Rev. A 6/92
Orig. 7/81
IPC-L-115
Specification for Rigid Metal Clad Base Materials for Printed
Boards
Superseded by IPC-4101
Rev. B 4/90
Rev. A 10/80
Orig. 3/77
IPC-L-120
Inspection Procedure for Chemical Processing Suitability of
Copper-Clad Epoxy-Glass Laminates
Obsolete without replacement
IPC-L-125
Specifications for Plastic Substrates Clad or Unclad for High
Speed/High Frequency Interconnections
Rev. A 7/92
Orig. 8/83
IPC-L-130
Specifications for Thin Laminates, Metal Clad, Primarily for
General-Purpose Multilayer Printed Boards
Superseded by IPC-L-108 and IPC-
4101
Orig. 1/77
IPC-DD-135
Qualification Testing for Deposited Organic Interlayer Dielectric
Materials for Multichip Modules
Orig. 8/95
IPC-EG-140
Specification for Finished Fabric Woven from "E" Glass for Printed
Boards
Amend. 1 & 2 6/97
Orig. 3/88
(301 Seiten)
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